Keynote – Aaron Chang – General Manager of MediaTek China, MediaTek
Mr. Chang has more than 20 years of experience in cellular chipset industry. His experience ranges from cellular engineering project management, competition analysis, business management, to China Cellular Operators and government relationship enhancement.
Mr. Chang was appointed as MediaTek General Manager of China since Year 2013, and mainly devoted his effort to business strategy development for China Cellular Operators, and government relationship enhancement. He is also the Chairman of LePower, a company fully owned by MediaTek focusing on analog chipset design.
Mr. Chang led the TD-SCDMA development effort in MediaTek, Beijing office since Year 2008 where he successfully launched TD-SCDMA product in Year 2011, and achieved significant market share in China 3G market. Under Mr. Chang’s supervision, the cooperative relationship between MediaTek and China Cellular Operators, China Mobile and China Unicom, are strong up.
Prior to joining MediaTek, Mr. Chang had taken various roles and positions from business to engineering management in several renowned semiconductor companies in California, USA.
Keynote – Dr. Shiuh-Wuu Lee – Executive Vice President, Technology Development, SMIC
Dr. Shiuh-Wuu Lee joined SMIC in 2010, and was named Vice President of Technology Development in September 2011. In June 2012 he was promoted to Senior Vice President, and on April 25, 2013, he took on the role as Executive Vice President. Dr. Lee has over 30 years of experience in the semiconductor industry. Prior to arriving at SMIC, he distinguished himself at Intel Corporation and AT&T Bell Laboratories, where he was engaged in logic technology development and developed state-of-the-art tools for microprocessor design. He twice received the Distinguished Technical Achievement award at Bell Labs, served as a technical director at Intel and was elected an Intel Fellow in 2004, the company’s highest technical honor. Dr. Lee received his Ph.D. from the University of Michigan. He is actively involved in semiconductor technology conferences, and he has 54 published technical journal and conference papers. He is the holder of three patents.
Keynote – Qian Guoliang – Executive Vice President, Datang Telecom Technology, Ltd
While joining the Datang Group, Mr. Qian Guoliang endeavored to promote the integration of IC industry resource in the “Group”, and hence established the Datang Semiconductor Co., Ltd of “4 BU+1” industrial layout. He lead the Leadcore to be the first that developed Soc LTE 4G chip with SDR, later cooperating with the Xiaomi to release “Hongmi 2A” 4G telephones, which sold over a million units in one day.
In 2014, Mr. Qian Guoliang was laureate as the “software industry pacesetter of Shanghai”. He has a PhD in computer application from Harbin Institute of Technology. He has been the Technical Director of Putian Institute, Deputy General Manager of LG Electronics (China) R&D Center, and Vice President of SK telecommunications investment (China) Co., Ltd. He has also been the member of the third generation mobile communications C3G expert group and of the TD-SCDMA expert group, as well as the leader of TD-SCDMA industry coordination group.
Driven by growth in the telecommunications market, China’s semiconductor industry is growing fast, contributing to rapid upgrade and ecological chain transformation of the global semiconductor industry. Chinese chipmakers will play a vital role in the semiconductor industry in the future. China is already the world’s largest producer and consumer of smartphones, and the ongoing Internet+ and industry 4.0 upgrade in China further this impact on the world. China’s semiconductor industry is now evolving from wireless communication to sensor technology, big data, cloud computing… Against such background, China Datang Corporation is making deployments in design and wafer manufacturing, which are the two most important links of integrated circuit industry. China Datang Corporation is also investing heavily in future telecommunication technology 5G standards and associated technology development, and is actively working with other links of the industry chain like MEMS manufacturers to create many more innovative applications for the upcoming smart connected world.
Leopold Beer – Regional President, AP, Bosch Sensortec
Leopold Beer graduated at the University of Stuttgart with a diploma in physics. As he specialized in semiconductor physics, he started his professional career as an engineer in the DRAM plant of Siemens Semiconductors in Regensburg /Germany in 1994. In 1997 he was assigned as head of the Electrical Failure Analysis Group of Siemens Semiconductors in Porto/Portugal. After the spin-off of Infineon from the Siemens Group, Leopold held various managerial positions within the Infineon Manufacturing Division.
In 2002 Leopold joined FCI Automotive as Market Segment Manager. Leopold entered Bosch Sensortec shortly after its foundation in 2006 as Sales Director and later became Head of Global Marketing and Product Planning. Since March 2013 he holds the position of Regional President for Asia Pacific and is based in Shanghai/China.
The market for MEMs sensors evolved significantly since first accelerometers where implemented in smart phones in 2006. Today we see technological dynamics in automotive, consumer electronics and in the emerging IoT Market. Sensor solution suppliers are faced with the opportunity and challenge of further market segmentation and additional solution pull. This change of context already impacts the way MEMS solutions are designed, manufactured, tested and implemented in short the whole value chain is impacted. Leopold will focus on the market evolution induced changes and provide some concrete examples of next generation solutions.
Ian Chen – Marketing, Systems Architecture, Software & Algorithms, Freescale Semiconductor
Ian Chen is a director leading marketing, systems architecture, software and algorithm development for Freescale’s Sensor Solution Division. Just prior to Freescale, Ian was executive vice president at Sensor Platforms focusing on context awareness and sensor data analytics. He has also held senior business, marketing and engineering leadership positions at Mobius Microsystems, Analogix Semiconductor, Cypress Semiconductor, IC Works, National Semiconductor and Texas Instruments.
Ian has a proven track record of identifying emerging market inflections early, and addressing them with leading edge products in such varied fields as sensors, timing, networking, microprocessors, and serial interface devices. Electronic Engineering Times identified Ian as one of the 40 key technologists to watch.
He received Bachelor and Master Degrees in electrical engineering and an MBA, all from the University of Illinois at Urbana-Champaign. He holds more than ten patents.
The Internet of Things (IoT) is driving explosive growth in connected devices and sensors. Sensor Data Analytics is finding its way into numerous opportunities. This session will cover how to unleash the information contained in sensor data for analysis that guides more informed decisions. We will look at how analytics can be applied to raw sensor data, referred to as Sensor Data Analytics. A focus will be on outlining new user experience examples and benefits of Sensor Data Analytics. Some portion will be spent on what MEMS sensors can sense and how to utilize them in continuous sensing and control systems. We will then cover how to use sensor data as part of control systems. Part of using data relies on adjusting system control based on continuous sensor input. Pattern recognition will materialize based on a collection of sensor data that will help make discrete decisions. Examples will include step detection, gesture recognition, and other situations of context. The methods of deterministic approach of machine monitoring and the probabilistic approach of monitoring a water pump will be demonstrated using statistical analysis. These are some of the tools and methods commonly used for Sensor Data Analytics that are creating new business models and new intelligent applications derived from sensor information. Many new use cases are originating from startups. These advances continue to enable new and unique applications across a broad base for industrial and embedded IoT markets. Open innovation, collaboration and attention to sensor data collection for a secure IoT continue to become more important.
Peter Hartwell – Senior Director of Advanced Technology, InvenSense
Dr. Peter G. Hartwell is Senior Director of Advanced Technology at InvenSense. Peter has extensive experience in commercializing silicon MEMS products, working on advanced sensors and actuators, and specializes in MEMS testing techniques. Prior to joining InvenSense, Peter spent four years as Architect of Motion Sensing Hardware at Apple. He was responsible for integration of motion and environmental sensors across the entire Apple product line. His team enabled new customer experiences including inertial sensors for activity tracking, gyroscopes for image quality, pressure sensors, and the M7 motion sensing processor. Prior to Apple, Peter spent twelve years as a Distinguished Technologist at Hewlett-Packard Laboratories. He was the MEMS lead on HP’s Atomic Resolution Storage program and developed a 10 nano-g/rt Hz MEMS accelerometer. Peter’s team used the accelerometer as the basis for creating HP’s Central Nervous System for the Earth (CeNSE), an early version of what has become the Internet of Things. Peter has over 40 worldwide patents on MEMS and sensor applications. He has a B.S. in Materials Science from the University of Michigan and a Ph. D. in Electrical Engineering from Cornell University.
The MEMS industry has experienced tremendous growth in the past 5 years, driven primarily by the inclusion of motion tracking devices, among a variety of MEMS-based sensors, in smart phones and other consumer electronic devices. Growth is expected to accelerate as Internet of Things (IoT) devices proliferate enabling the cloud to connect with, and sense, the ambient world in order to make intelligent real time decisions. The world of ambient computing presents challenges, and opportunities, for the MEMS industry. MEMS companies can continue to manufacture sensor components, built to the specs of the OEMs and big data companies, just as semiconductor companies have done for decades. The industry however, has the opportunity to capture additional value by delivering intelligent sensors that create a more efficient system by transmitting not just raw sensor data, but rather information and context to the cloud. IoT companies will accelerate as the focus will be on applications of information rather than collection and analysis of raw sensor data. The industry needs to build expertise in sensor intelligence, system knowledge, and even big data, in order to not just participate, but thrive, in the forthcoming Internet of Sensors.
Dr. Pengju Kang – Technology Leader, GE Global Research
Dr. Pengju Kang is a Technology Leader of GE Global Research. Dr. Kang leads a R&D organization with 5 divisions working in areas of power electronic systems, power systems, real time controls, system integration and analysis, and control platforms. The technologies developed out of Dr. Kang’s teams have generated significant impacts to many GE’s businesses such as power, industrial controls, oil and gas, and health care.
Before GE, Dr. Kang had been with Cummins for 3 years working on hybrid powertrain simulation, modeling, and controls. Before Cummins, Dr. Kang had been with the United Technologies Corporation for 8 years working on technologies such as fly-by-wire helicopter flight controls, integrated vehicle health monitoring, elevator controls, distributed power generation, building control and security systems, and large air-conditioning system controls and diagnostics.
Dr. Kang received his PhD in Electrical Engineering (EE) from Queensland University of Technology, MBA and Master of Computer and System Engineering from Rensselaer Polytechnic Institute, and Bachelor and Master of EE from Huazhong University of Science and Technology.
To date, Dr. Kang has more than 30 technical publications, 19 patents issued, and 52 patent applications filed.
Industries are on the verge of a new era of innovation with the rise of Industrial Internet. Change is taking place through the convergence of industrial systems with the power of cloud computing, advanced analytics, smart sensing, and new levels of connectivity. Industrial Internet is beginning to shape and redefine the boundaries within which traditional industrial enterprises are being operated through increased productivity, flexibility, and responsiveness of connected machines.
It is predicted that 50 billion machines will be connected to the Industrial Internet by 2025. To maximize the values in scale out of the connected machines, an open robust Industrial Internet architecture is essential. Three key technical capabilities are the prerequisites for successful deployment of Industrial Internet systems. They are connected brilliant machines enabled by smart sensors plus advanced controls, and tools and analytics empowering people at work.
Karen Lightman, Executive Director, MEMS Industry Group
Karen Lightman is Executive Director of MEMS Industry Group and active on the worldwide MEMS conference circuit as a keynote speaker and panelist promoting MIG’s role as the leading trade association advancing MEMS across global markets. Karen joined MIG from Carnegie Mellon University’s Center for Economic Development, where she was senior policy analyst. Prior to Carnegie Mellon, she was senior associate at Cleveland Tomorrow, a public-private partnership, and before that, she was a program associate with the Ford Foundation. Karen has a BA from the University of Vermont (UVM) and a MS in Public Policy from Carnegie Mellon University.
Benedetto Vigna – Executive Vice President, STMicroelectronics
Benedetto Vigna is Executive Vice President, General Manager of the Analog, MEMS & Sensors Group, and has held this position since September 2011. He is a member of ST’s Corporate Strategic Committee.
Vigna joined STMicroelectronics in 1995 and launched the Company’s efforts in MEMS. Under his leadership, ST’s MEMS sensors found early success with large OEMs for motion-activated user interfaces and ST has become the MEMS top maker. More recently Vigna has piloted ST’s successful moves into microphones, magnetic sensors, and touch-screen controllers, as well as environmental sensors, micro-actuators, and low-power radios. Vigna’s responsibilites also include ST’s Sensors, RF, High-Performance Analog and Mixed Signal, Interface, Audio for Portable, and General-Purpose Analog products.
Vigna has filed more than 170 patents on micromachining to date, authored numerous publications, and delivered many speeches at international conferences. He sits on the industrial board of several EU-funded programs. Vigna’s contributions to the MEMS industry have been recognized with the Executive of the Year Award by the MEMS Industry Group (2013), the European SEMI Award (2013), and the IEEE Frederik Philips Award (2015).
Benedetto Vigna was born in Potenza, Italy, in 1969, and graduated with a degree in Subnuclear Physics from the University of Pisa, Italy.
From the Nintendo Wii, arguably the first mass consumer-market product enabled by MEMS and Sensors, to Smartphones, which have been the most recent high-volume driver of MEMS and Sensor adoption, we have seen dramatic growth and change in the marketplace. Still, while we’re far from exhausting the potential of existing MEMS in existing and derivative applications; the best is yet to come. The next wave of MEMS development is moving toward actuation and, while the ripples from these beautiful little machines have been building slowly for years, as they converge with those from the Internet of Things, the ride is about to get more exciting! Some examples of what we are seeing as first applications include tiny mirrors that enable people to interact more naturally with technology, smaller, faster autofocus solutions for cellphones and new types of printheads for 3D printing – and this is just the beginning.
Yangxi (Michael) Wang – Business Development Manager, Texas Instruments
Yangxi Wang is a business development manager of DLP products at Texas Instruments with more than ten years of experience in semiconductor industry. He focuses on bringing DLP technology into emerging markets such as personal electronics, automotive and industrial. He has a proven track record of identifying new markets, managing business strategies and developing an effective eco-system to grow the business. Prior to this role, Yangxi was a marketing manager of Visible LEDs at Osram Opto. Before that, he started his career at Texas Instruments as an applications engineer for DLP products. Yangxi holds a master degree of engineering in signal and information processing from Zhejiang University, China.
Texas Instruments DLP® chipsets are the world’s leading projection display technology, including digital cinema, business, education and home theater applications. While renowned for these applications, DLP technology is highly flexible and enables a diverse range of display and advanced light control applications spanning industrial, enterprise, automotive and consumer market segments. How to enable a broader customer base in these many new segments to adopt DLP technology easily and quickly has been a challenge considering the complexity of the technology that requires customers to have the knowledge not only in electronics but also in optics, mechanics and system. This session will address how Texas Instruments find its way in China by developing the fitting business/ technology model and building up an eco-system to solve this challenge and enable customers to develop highly differentiated and innovative products with the exciting DLP technology.
X.J. Zhang – President, Nanopolis
Dr. Xijun Zhang is Chairman and President of Nanopolis Suzhou Co. Ltd. Dr. Zhang leads his team in establishing and cultivating a “Nanotech Industry Ecosystem”, which involves various resources and entities that are required for nanotech innovation and commercialization. MEMS is one of the most important industries that Dr. Zhang and his team focus on. A MEMS pure play commercial pilot line was setup together with a new model of technology transfer called IP Mart to help institutions and companies to leverage existing inventions. Nanopolis is also the name of the world-class nanotech innovation & industrialization community, which provides incubation services, engineering services and other auxiliary amenities, and supports R&D, pilot production, manufacturing of various nanotech products. Dr. Zhang also serves as Vice Chairman of MEMS Branch of Chinese Semiconductor Industry Association and General Secretary of Suzhou IC Industry Association.
Dr. Zhang has held positions in many international companies such as Alcatel, Lucent, Telcordia (formerly Bellcore), Quantum Bridge (acquired by Motorola), and has many years experience in the support of science & technology development and promotion of emerging industries. He received his Ph.D. in electrical engineering from the State University of New York at Buffalo.
Increasing the speed of innovation, and developing an indigenous ecosystem which will facilitate that goal, is a high priority for both Chinese technology companies and the local, provincial, and national governments in China. Patents, and IP in general, are valuable resources that can be reused to leverage existing knowledge, to identify areas of research and development where innovation effort should be spent, and to avoid delays and costs caused by unneeded reinvention. The Chinese government, at all levels, have recognized this and have created new initiatives and proposals to provide support for small and medium size companies to obtain the knowledge and access they need for patents and IP, so they can take advantage of those resources.
This presentation will provide an overview of the activities currently underway in the semiconductor sector and will be focused on the MEMS IP Mart program based in Nanopolis/Suzhou to support MEMS companies for sensors and actuators system market. The program is designed to help companies identify critical patents and IP which they can choose to license or use to determine areas for internal development. The MEMS IP Mart will also assist in matchmaking between patent owners, licensees, and facilities where that IP can be used. This method can be used as a template by the government for the actions being taken in other technology areas.
Neil Zhao – ASIA MEMS/Sensors Marketing and Applications Manager, Analog Devices
Neil Zhao is currently Analog Devices, Inc.’s MEMS / Sensors Marketing and Applications manager for ASIA area. He focuses on ADI MEMS accelerometers, MEMS gyro and MEMS IMU, and is responsible for their promotion, applications and new products definition.
Since joining ADI in 2008, he has worked on ADC, Amplifier, Wireless, MCU and Power chips. He moved to MEMS product line in 2010 and concentrate on MEMS/Sensors development and applications after that.
Mr. Zhao received master degree in communication and information system from Beijing University of Aeronautics and Astronautics in 2008. He has published around 10 papers in many fields which including well logging, base station, and MEMS. He also finished around 10 reference designs which are used successfully in well logging, base station and healthcare.
Mr. Zhao lives in Beijing now and studying Chinese history is his hobby.
Whatever you choose to call the latest disruptive technology wave (Industrial 4.0, IoT/IoE,..), the development and deployment of ever more intelligent, trusted, Smart Sensing solutions will be a key enabler underpinning future eco-systems. A framework will be presented which demonstrates ways Analog Devices is enabling the next wave of smart sensing solutions
Panelist – David Allan – President, Virtuix, Inc.
After graduating from the University of Waterloo’s systems design engineering program, David Allan spent twenty years launching complex electrical, optical, and mechanical products in Asia. He has led teams at a major contract manufacturer, Flextronics, and participated in successful startups in Taiwan and China.
At Flextronics, David managed supply-chain operations at four manufacturing sites in China and Malaysia, supporting $350 million in annual sales to Apple, HP, Dell, Nokia, Motorola, and Sony Ericsson. From Flextronics, David joined ERP Power LLC, a U.S. startup that became a world leader in high-efficiency LED drivers. David set up its China manufacturing facility, served as the factory’s legal head, and grew China staffing to 400 employees.
In 2013, David joined Virtuix Inc. as president to help solve one of VR’s oldest challenges: how to move around in the virtual world. The Virtuix Omni™ enables you to walk, run, and jump in 360 degrees, immersing your mind and body in the virtual world. Virtuix launched the Omni on Kickstarter, generating $1.1 million in advance sales, and went on to raise $8 million from Mark Cuban and various Silicon Valley VCs. Mass-production of the Omni will start in 2016.
Panelist – Xianfeng (Sean) Ding – Director of Sensing, Chief Scientist, Huawei
Xianfeng Ding is the chief data scientist for data mining for next generation of Internet of Things and wearables. He has 15 years of experience in the sensing industry, including principal engineering in STmicro, engineering manager in Bosch, and PE in Intel. He is a highly experienced architect in sensing and control industry, with 15 years experience in signal processing, pattern recognition, artificial intelligence, activity recognition, and context awareness. He has in-depth knowledge of sensing systems, including physical design of MEMS and sensor, circuitry, algorithm optimization, and system implementation.
Panelist – Hudson Ho – Executive Director, Head of China Division, Korea Investment Partners
Hudson is an Executive Director and the Head of China Division. He has been with the firm since 2000 and has led transactions including KODI-S, NeoFidelity and Wisol before he moved to his current position in China in 2008. Hudson was also awarded Best Venture Capitalist in 2009 by the Korean government. Previously, Hudson worked as a business consultant at Anderson Consulting for 3 years, providing corporate restructuring, new business development strategy and IT consulting services to client companies. Hudson also serves as the lead manager of KIP’s first RMB fund(RMB 100mn). Hudson studied Business Administration at Seoul National University and is fluent in Chinese and English.
Moderator – George Hsu, chairman of the board, PNI Sensors
George Hsu is the technical visionary of PNI Sensor Corporation. As founder of PNI Sensor, he invented what is still recognized as the highest-sensitivity non-cryogenic magnetic sensor in the world. George has focused his 25+ year career on the sensor industry, having invented magnetic sensing breakthroughs, sensor fusion coprocessors, and algorithms and software.
Gifted with deep insight into the entire sensing value chain, from transducers to end-user applications, he has the unique ability to understand both technical and market requirements. This expertise has enabled him to lead technical teams that consistently advance the user experience within the mobile, wearable and IoT markets.
George is a genuine entrepreneur, having founded PNI Sensor while he was still a senior at Stanford University’s School of Engineering. He was also the founder of Sensor Platforms Incorporated and was one of the first members of the team at mCube.
Panelist – Andrew Kung – General Manager, Colt Advance
Andrew Kung, an ICT industry professional with more than 25 years of experience in the IC products and consumer electronics field, founded Colt Advance International Limited with focus in providing intelligent control products and solutions. He held Business and Management positions in Motorola (Freescale) Semiconductors, Solomon Systech Limited and other high tech companies, with successful track records of managing business strategies; sales and market development, customer and product development. He served in diversified business and technical positions in different global cities including Hong Kong, Beijing, Shanghai and Australia. Andrew graduated from The Hong Kong Polytechnic University in Electronics Engineering. He also has Engineering Master Degree from The University of Hong Kong, Executive MBA and Master of Global Political Economy from The Chinese University of Hong Kong. He is currently a member of IET, UK.
Moderator – Ben Lee – President and CEO, mCube
Mr. Lee is President and Chief Executive Officer of mCube. He has over 20 years of senior management experience in the semiconductor industry with a successful track record of driving rapid revenue and profit growth. As CEO, Mr. Lee is responsible for shaping the strategic direction of mCube, maker of the world’s smallest MEMS inertial motion sensors for the Internet of Moving Things.
Prior to mCube, he served as Senior Vice President of Worldwide Sales at Cypress Semiconductor Corporation. Prior to Cypress, he served as Vice President of Worldwide Sales at Trident Microsystems and Chief Operating Officer at Apexone Microelectronics, based in Shanghai. Mr. Lee has also served as Vice President Asia Pacific Sales at Altera Corporation, General Manager of China at National Semiconductor Corporation and Vice President of Worldwide Marketing at Chartered Semiconductor Manufacturing.
Mr. Lee began his career as a System Integration Engineer at IBM’s Federal Systems Division in New York. He holds a BSEE from California Polytechnic State University, San Luis Obispo, and a MBA from Golden Gate University, San Francisco. Mr. Lee serves on the Industry Advisory Board for Cal Poly Electrical Engineering and is a Board Director of Ten Degrees, Inc.
Panelist – George Liu – Senior Director, Sensor Display & Business Development, TSMC
Mr. George Liu joined TSMC in 2007 as the Director of Mainstream Technology Business Development. He has overseen a variety of initiatives at TSMC including More-than-Moore technology definitions and business development. Lately, he focuses on sensor and display business development.
George brings over 25 years of IC industry experience to TSMC. He spent 20 of those years at Intel. From process engineer to design manager to product line director, George has managed a broad range of functions in the US, Asia, and greater China.
After Intel and before TSMC, George worked as Vice President at Primarion, a digital Power IC startup, and Vice President at Vanguard International Semiconductor, a TSMC subsidiary company.
Mr. Liu holds a B.S. of Physics from National Taiwan University, and an M.S.EE from Arizona State University.
Moderator – Doug Sparks – Executive Vice President, Hanking Electronics
Doug Sparks is the Executive Vice President Hanking Electronics where they are working on a new MEMS wafer fab and packaging facility in Shenyang, China. Prior to joining Hanking he was the founder and President of Nanogetters which offers vacuum packaging services for MEMS devices. He was also the Executive Vice President at Integrated Sensing Systems Inc for 10 years where he directed the development and commercialization of MEMS/microfluidic products. He worked at Delphi Automotive System’s Delco Electronics Division for 17 years in the area of MEMS and integrated circuits both in process and packaging. He has published over 100 technical papers, has 47 US and Japanese patents and has a PhD in Material Science from Purdue University.
Panelist – Gary Yao – Advanced Technology Manager, HTC America
Gary Yao is with HTC Corporation, a global leader in smartphone innovation and design. As Advanced Technology Manager at HTC America Innovation, Gary is responsible for technology scouting, evaluation, and potential acquisitions. Located in San Francisco, Gary is working with the team to continue exploring breakthrough and disruptive technologies in Silicon Valley and worldwide; push the boundaries of design to create personal experience for customers around the globe. Prior to joining HTC, Gary had many years’ experience in hardware design and semiconductor industry, involved in integrated circuit design, embedded system, and device manufacturing for mobile computing and consumer electronics.
Panelist – Hing Wong – Managing Director, Walden International
Mr. Hing Wong, Managing Director of Walden International, focuses on investments of semiconductors, electronics, IoT and materials, especially in China. His investments include GalaxyCore, Sinosun, Silergy, GigaDevice, DJI and etc. He received the 2013 Investor of the Year Award from HYSTA, the influential Chinese business association in Silicon Valley.
Prior to joining Walden International, he spent fifteen years in the semiconductor industry in technical, management and business roles. He worked many years at IBM and co-founded Silicon Access Networks, a network IC company where he served as VP VLSI Design and later in VP Business Development. Hing holds a Ph.D. degree in EECS from UC Berkeley, and studied in SiChuan University and Chinese University of Hong Kong for his undergraduate degrees.
Panelist – Ian Wright – Regional Marketing Director for Asia, SPTS Technologies
Ian Wright is the Regional Marketing Director for Asia at SPTS Technologies.
He supports the regional offices and customer activities across all product groups, including the development of new business opportunities. Ian has been in the industry for more than 27 years and has been especially involved in the development of DRIE applications for MEMS, Optics and Packaging, amongst others market segments.
He has a Bachelor’s degree in Mechanical Engineering and more than two decades of experience in plasma process equipment industry, formerly at STS and now SPTS. At STS, Ian was responsible for managing the company’s sales, marketing and support activities in Asia (excluding Japan). With SPTS, he was Sales Director for Southeast Asia until he took on the current role in 2011.
Ian is based in Singapore, and is a keen ultra runner.
Panelist – Zheng Yuan – VP & General Manager, 200mm Systems and Upgrades, Applied Materials
Zheng Yuan is Vice President and General Manager for 200 mm Equipment and Upgrades, within Applied Global Services at Applied Materials, Inc. He is responsible for 150/200 mm product lines and Subfab energy saving and greenhouse gas reduction solutions.
Dr. Yuan has held management positions at Applied for last 15 years in dielectric gap fill technologies, thin film solar and 200 mm products. He was instrumental in Applied’s Producer HARPTM for Shallow Trench Isolation (STI) and Pre-Metal Dielectric (PMD) gap fill in advanced flash and logic device applications.
Prior to joining Applied, Dr. Yuan was a technology manager at Watkins-Johnson Company and focused on the APCVD process and product development.
Dr. Yuan holds a Ph.D. in chemistry from the University of Waterloo, Canada, a master of science degree in chemistry from Brock University, Canada and a bachelor of science degree in chemistry from the Beijing Institute of Technology, China. He has published more than 20 technical papers and holds more than 20 U.S. patents in thin film semiconductor technologies.